Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding
نویسندگان
چکیده
Self-propagating exothermic reactions (SPERs) provide intense localized heat sufficient for bonding metals or alloys with minimal excursion to the components, which shows great potential die-attach in power electronics packaging. However, reliability of such formed joints is yet be fully understood owing a wide range defects involved instantaneous propagating reaction and heating/cooling. In this work, finite element analysis performed understand thermal transfer mechanical responses materials SPER Si device onto direct bonded copper (DBC) substrate Sn-3.0Ag-0.5Cu (SAC) solder. The simulation has been validated using temperature distribution bonding, good agreement actual measured results. Moreover, systematic investigation on due mismatch reveals their effects stress interfaces reliability.
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ژورنال
عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology
سال: 2021
ISSN: ['2156-3950', '2156-3985']
DOI: https://doi.org/10.1109/tcpmt.2021.3108017